Summary written by USA Jobs 24 from Boeing's advert and our data on 17,030 current US jobs. How we check every job
At a glance
Boeing is hiring a ASIC / FPGA Digital Design Engineer – (Lead or Senior) in El Segundo, CA; Huntington Beach, CA. It is a full-time role in Hardware & Semiconductors, asking for at least 9 years of experience, first listed on November 3. The advertised pay is $146,200–$197,800 a year. The description mentions RTL design. Boeing has 149 other openings in the US, 25 of them in El Segundo, CA. Across all employers on USA Jobs 24 there are 5 Hardware & Chips openings in El Segundo, CA today; the typical one asks for 3 years and advertises about $141,000 a year at the midpoint.
How the pay compares
Boeing advertises $146,200 to $197,800 a year, a midpoint of $172,000 a year. Where an offer lands in a range usually depends on experience and on the exact location. That is lower than about 69% of the 86 hardware & chips jobs in California that publish a yearly rate on USA Jobs 24, where the typical midpoint is $197,000 a year. To see roughly what this leaves after federal and California tax, try our take-home pay calculator.
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Before you apply
- Check it is still open. We found this job on Boeing's Workday site on November 3 and checked it again November 4, 5:17 AM ET. When an employer takes a job down, we remove it at our next daily update.
- Check the location works for you. This role is based in El Segundo, CA (or one of 1 other locations). If you would need to move, ask whether relocation help is offered.
- Match the experience. The advert asks for at least 9 years of experience. If you are a little short, a close match on the skills in the advert can still win an interview.
- Tailor your resume. Use the advert's own words, such as RTL design, wherever they are true for you. Our resume guide shows how.
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About hiring at Boeing
Boeing has 150 openings on USA Jobs 24 today across 21 states. Most are in software & IT (84), operations (14) and engineering & mfg (7). The biggest locations are Berkeley, MO (31), El Segundo, CA (26) and Hazelwood, MO (22). None of them is fully remote, 20% are open to entry-level candidates and 97% show pay. We collect Boeing's jobs every day straight from its own careers system (Workday), never from job boards or agencies.
The employer's advert
This is Boeing's own description of the job, copied word for word from its careers site. We have not edited it.
Show the full advert from BoeingHide the advert1,303 words
Company:
Boeing Space, Intelligence & Weapons Systems has an exciting opportunity for multiple ASIC/ FPGA Digital Design Engineers – (Lead or Senior) to join us as part of our Boeing Electronic Products team at the heart of Boeing’s products to support advanced digital subsystem development in an aerospace environment in El Segundo or Huntington Beach, CA.
Engineers may support ASIC, FPGA, or mixed ASIC/FPGA developments depending on program assignment, technical specialization, and organizational needs. Work may include requirements development and capture, architecture support, HDL development, simulation, synthesis, FPGA implementation, timing analysis, integration, troubleshooting, verification collaboration, and traceability activities depending on role level and assignment scope.
Programs, Products, & Growth Opportunities
Engineers contribute to advanced aerospace and defense programs spanning space, aviation, communications, and autonomous systems. Programs may include next-generation satellite and space systems, modules supporting NASA missions, Space Launch System (SLS)-related technologies, commercial and military aircraft platforms, autonomous aviation technologies, and emerging digital architectures supporting future aerospace systems.
Engineers support a broad portfolio spanning ASICs, SoCs, and FPGAs across multiple concurrent aerospace and defense programs. Collaborations within the broader organization include space and satellite efforts, commercial and military aviation programs, and autonomous aviation initiatives involving organizations such as Millennium Space Systems and Wisk Aero.
Department expertise spans requirements development, architecture activities, RTL design, ASIC development, FPGA implementation, timing analysis, verification collaboration, integration support, and system-level troubleshooting.
Engineers have opportunities to broaden across conceptual architecture, requirements development, HDL ownership, FPGA implementation, timing analysis, verification collaboration, subsystem development, and integration activities while deepening selected technical specialties over time. The organization intentionally supports growth from focused contributors toward broader technical ownership, subsystem responsibilities, mentorship, and technical leadership roles as experience develops.
Teams are intentionally composed of engineers with complementary strengths spanning architecture, implementation, verification, integration, timing, and troubleshooting. The role is not intended to imply that every engineer must simultaneously be an expert in all disciplines.
Responsibilities
• Support ASIC, FPGA, or mixed ASIC/FPGA developments depending on assignment
• Contribute to requirements development, refinement, interface definition, conceptual architecture activities, and traceability efforts appropriate to role level
• Develop HDL / RTL for ASIC, FPGA, and SoC systems
• Compile, simulate, debug, and troubleshoot digital designs
• Perform and/or support synthesis, implementation, constraints development, timing closure, and tool execution activities
• Collaborate with verification teams to support simulation, debug, coverage, and integration goals
• Apply timing concepts, CDC fundamentals, and integration considerations
• Support broader system troubleshooting and integration activities
• Communicate technical status, risks, dependencies, and tradeoffs proactively
Behavioral Expectations
• Operate with ownership appropriate to role level
• Independently manage assigned scope and execution
• Develop technical breadth while deepening selected expertise
• Support peer development and technical collaboration
• Build systems awareness beyond immediate design boundaries
• Contribute to technical leadership activities appropriate to level
Lead, Level 4
• Support subsystem ownership activities
• Mentor others
• Lead larger technical efforts, integration activities, or technical teams
Senior, Level 5
• Provide technical leadership
• Support architecture direction and broader technical ownership
• Lead teams, subsystem efforts, and cross-functional initiatives
This position is expected to be 100% onsite. The selected candidate will be required to work onsite at one of the listed locationa.
Basic Qualifications (Required Skills/Experience):
This position requires the ability to obtain a US Security Clearance for which the US Government requires US Citizenship as a condition of employment. An interim and/or final U.S. Secret Clearance Post-Start is required.
Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
Bachelor’s degree and 9+ years of experience with years FPGA, ASIC, or SoC digital design; or a BS/MS and 7+ years of FPGA, ASIC, or SoC digital design experience
Experience with HDL development, simulation, debug, and synthesis
Strong digital design fundamentals (projects with digital logic design, computer architecture, etc)
Experience troubleshooting digital systems (debugging RTL design, HDL/architecture)
Understanding of timing fundamentals and CDC concepts
Preferred Qualifications (Desired Skills/Experience):
Senior, Level 5: 14+ years of related engineering experience
Bachelor’s Degree or Master's Degree in EE, Computer Engineering/Science, or related field
Requirements development and traceability experience
FPGA implementation including constraints and timing closure
Static timing analysis experience
Verification collaboration experience
High-speed interfaces, processor integration, memory subsystems, or SoC integration
Mentoring or technical leadership exposure
Familiarity with industry-standard tools and methodologies
Conflict of Interest:
Successful candidate for this job must satisfy the Company’s Conflict of Interest (COI) assessment process.
Typical Education/Experience:
Lead, Level 4: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), computer science, engineering data science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience or non-US equivalent qualifications. In the USA, ABET accreditation is the preferred, although not required, accreditation standard.
Senior (Level 5): Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), computer science, engineering data science, mathematics, physics or chemistry (e.g. Bachelor) and typically 14 or more years' related work experience or an equivalent combination of technical education and experience or non-US equivalent qualifications. In the USA, ABET accreditation is the preferred, although not required, accreditation standard.
Relocation:
This position offers relocation based on candidate eligibility. Note: Basic relocation will be offered for eligible internal candidates.
Drug Free Workplace:
Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.
Shift Work:
This position is for 1st shift.
Total Rewards:
At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.
The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.
The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.
Pay is based upon candidate experience and qualifications, as well as market and business considerations.
Summary pay range for Lead, (Level 4): $146,200 - $197,800
Summary pay range for Senior (Level 5): $164,900 - $223,100
Language Requirements:
Not ApplicableEducation:
Bachelor's Degree or EquivalentRelocation:
This position offers relocation based on candidate eligibility.Export Control Requirement:
Safety Sensitive:
Security Clearance:
This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret Clearance Post-Start is required.Visa Sponsorship:
Employer will not sponsor applicants for employment visa status.Contingent Upon Award Program
This position is not contingent upon program awardShift:
Shift 1 (United States of America)Stay safe from recruitment fraud! The only way to apply for a position at Boeing is via our Careers website. Learn how to protect yourself from recruitment fraud - Recruitment Fraud Warning
Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.
Boeing Participates in E – Verify
Right to Work Statement
USA Jobs 24 copied this listing from Boeing's official careers site on November 3, 2026 and checked it again November 4, 5:17 AM ET. Boeing will never ask you to pay to apply or to buy equipment with a check they send you. If anyone does, it is a scam.
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