Summary written by USA Jobs 24 from HP's advert and our data on 17,030 current US jobs. How we check every job
At a glance
HP is hiring a Vice President - PS Agentic AI PC Architecture & Development in Palo Alto, CA; Spring, TX. It is a full-time role in Data, AI & Analytics, asking for at least 10 years of experience, first listed on November 1. The advertised pay is $300,000–$350,000 a year. The description mentions Embedded C and Generative AI. HP has 99 other openings in the US, 9 of them in Palo Alto, CA. Across all employers on USA Jobs 24 there are 53 Data & AI openings in Palo Alto, CA today; the typical one asks for 6 years and advertises about $252,000 a year at the midpoint.
How the pay compares
HP advertises $300,000 to $350,000 a year, a midpoint of $325,000 a year. Where an offer lands in a range usually depends on experience and on the exact location. That is higher than about 92% of the 559 data & AI jobs in California that publish a yearly rate on USA Jobs 24, where the typical midpoint is $229,000 a year. To see roughly what this leaves after federal and California tax, try our take-home pay calculator.
Skills in this advert
How often each skill named in this advert appears across the 1,778 data & AI jobs we list today. Generative AI is the most widely requested (37% of jobs), while Embedded C is the least common (1%). Widely requested skills are what employers expect as a baseline; rarer ones show what is special about this job.
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Before you apply
- Check it is still open. We found this job on HP's Workday site on November 1 and checked it again November 4, 5:17 AM ET. When an employer takes a job down, we remove it at our next daily update.
- Check the location works for you. This role is based in Palo Alto, CA (or one of 1 other locations). If you would need to move, ask whether relocation help is offered.
- Match the experience. The advert asks for at least 10 years of experience. If you are a little short, a close match on the skills in the advert can still win an interview.
- Tailor your resume. Use the advert's own words, such as Embedded C and Generative AI, wherever they are true for you. Our resume guide shows how.
- Know your number. Decide the lowest offer you would accept before the first call. Our salary negotiation guide explains how to ask for more.
- Apply only through HP's own site. Our Apply button goes straight to HP's Workday page. If anyone contacts you about this job and asks for money, gift cards or bank details, stop and check it with our scam checker. Read how to spot a fake job offer.
About hiring at HP
HP has 100 openings on USA Jobs 24 today across 27 states. Most are in software & IT (31), sales & BD (15) and data & AI (12). The biggest locations are Spring, TX (34), Vancouver, WA (18) and San Francisco, CA (10). None of them is fully remote, 12% are open to entry-level candidates and 94% show pay. We collect HP's jobs every day straight from its own careers system (Workday), never from job boards or agencies.
The employer's advert
This is HP's own description of the job, copied word for word from its careers site. We have not edited it.
Show the full advert from HPHide the advert1,342 words
Description -
Position Overview
The Vice President, Agentic AI Systems & Solution Engineering reports into PS engineering leadership and is accountable for common Agentic AI systems architecture, engineering execution and product delivery. The role leads a global, matrixed engineering organization from requirements and system design through development, integration, validation, production release and sustaining.
Working with division leaders and Product Management, this leader converts customer priorities into technical requirements, a prioritized roadmap and executable delivery commitments. Division leaders and PM own customer, portfolio, product and commercial decisions. The VP owns engineering feasibility, architecture, resources, schedule, quality and delivery, with shared accountability for customer adoption and business impact.
Solution Ownership and Deliverables
Own engineering delivery across four connected solution areas, using shared architecture and agreed interfaces with HP platform, security and product teams.
• Device-aware AI execution. Own workload and memory governance, foreground protection and placement policies across PC, edge and cloud. Deliver production orchestration, policy and telemetry components with tested HP product and runtime integrations.
• Proximal intelligence. Own context, presence and coordination across PCs, docks, displays and collaboration workspaces. Deliver reusable context and device-coordination services and device interfaces for validated, consent-aware workspace readiness and session-transition experiences.
• Trusted agent execution. Own integration of hardware-rooted trust, isolation, agent identity and action policies. Deliver enforceable access and action boundaries, auditability and enterprise controls with HP’s security and manageability teams.
• Agentic distribution. Own trusted compute discovery, device-capability and model-compatibility checks and authorized task handoff across devices. Deliver distributed execution services, runtime integration APIs and deployable packages supporting continuity, progress visibility and return of results.
Key Responsibilities
Engineering Execution and Product Delivery
• Own the integrated engineering plan from concept through production and sustaining. Establish deliverables, named owners, milestones, capacity, critical dependencies and release criteria for each committed product or solution.
• Translate PM-aligned customer needs into functional requirements, engineering specifications, architecture and prioritized development backlogs. Agree scope and acceptance criteria with product owners, and manage changes against delivery commitments.
• Run a disciplined delivery cadence with engineering, program management and validation leaders. Track progress against evidence, resolve blockers, escalate decisions early and execute recovery plans when scope, schedule, cost or quality is at risk.
• Lead productization through integration, hardening and validation of PM-agreed customer scenarios. Deliver release-ready software and firmware packages, deployment and update mechanisms, validation evidence and documented sustaining handoffs through alpha, beta, pilots and production release.
Architecture and Platform Leadership
• Own the common Agentic Computing Foundation and its reference architecture, engineering specifications and technical standards. Deliver reusable libraries, services, SDKs and documented interfaces that product teams can integrate and support across PS.
• Define the technical roadmap and integration contracts across the four solution areas. Combine HP-owned system capabilities with OS, silicon, AI-runtime and cross-HP platform technologies, with explicit component ownership and release dependencies.
• Make system-level trade-offs across performance, memory, power, thermals, latency, security and cost. Define measurable foreground-experience limits and validate them with realistic concurrent user and agent workloads.
Quality and Security Across the Product Lifecycle
• Embed security, privacy, reliability and enterprise manageability into requirements, architecture and release gates. Establish test coverage, AI evaluation, compatibility, performance and recovery criteria with the responsible domain teams.
• Own product lifecycle engineering discipline, including defect closure, deployment and update readiness, telemetry, supportability and field feedback. Use customer and production evidence to improve subsequent releases.
Ecosystem and Partner Leadership
• Lead technical engagement with OS/platform, silicon, ISV, AI platform/model and enterprise partners. Convert joint roadmaps into agreed interfaces, deliverables, resourcing and integration milestones.
• Resolve cross-HP and partner dependencies through clear technical ownership and interface agreements. Use external engagement and technology scouting to improve the product roadmap and accelerate delivery.
Organization and Engineering Resource Leadership
• Build and lead the engineering organization, hire critical talent, develop leaders and manage performance. Establish ownership across architecture, development, integration, validation and engineering program management.
• Own engineering budgets and capacity plans. Prioritize investment and make build, reuse and partner decisions with division leaders; improve engineering productivity through shared platforms, automation and AI-enabled development.
Key Qualifications
Required
• 10+ years in systems engineering spanning hardware, firmware, silicon (CPU/GPU/NPU), memory, OS/runtime and software, with a record of shipping platform-level systems.
• 8+ years leading large, globally distributed, matrixed engineering organizations with shared or division-funded resources.
• Demonstrated end-to-end delivery of complex products: requirements, architecture, development, integration, validation, production release and sustaining. Evidence of predictable execution, recovery of at-risk programs and management of engineering budgets and capacity.
• Experience taking AI or Agentic AI systems from concept to production with measurable customer and revenue or margin impact in client, server or edge deployments.
• Direct experience with server, data-center or distributed/edge infrastructure, including compute, memory, networking and workload placement, and the ability to apply that experience to client-connected solutions.
• Experience building reusable platforms that scale across multiple product lines and deployment environments, with sound judgment on system-level trade-offs.
• Senior-level co-engineering experience with platform, silicon and software partners. Ability to align division leaders and represent engineering at SVP/EVP level without direct authority.
• Working knowledge of identity, isolation, trust and enterprise manageability, including Zero Trust, TPM/Secure Boot and compliance requirements across client and server/edge environments.
Preferred
• Practical experience with LLM inference, AI runtimes, agent frameworks and coding in client and server environments.
• Bachelor’s degree in Computer Science, Computer Engineering, Electrical Engineering or a related field; an advanced degree such as an MS or MBA is a plus.
Success Measures
• Committed solution releases and reusable components shipped in HP products with agreed scope, schedule, quality and cost; customer scenarios validated against acceptance criteria.
• Customer adoption and business contribution of delivered solutions, measured with division leaders and PM through customer outcomes, differentiation and revenue or margin impact.
• Foreground responsiveness, reliability, security and manageability validated under representative workloads, with improvements in escaped defects and field issues.
• Reuse of common architecture and capabilities across PS divisions; faster integration and time to market, with partner dependencies delivered against commitments.
• Critical hiring and retention, leadership development, engineering productivity and delivery within approved capacity and budget.
Leadership Behaviors
Start with the customer. Develop the team. Own the outcome. Make timely technical and investment decisions, surface delivery risks early, and follow through on commitments across organizational boundaries.
The pay range for this role is $300,000 to $350,000 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- Generous time off policies, including;
- 4-12 weeks fully paid parental leave based on tenure
- 11 paid holidays
- Additional flexible paid vacation and sick leave (US benefits overview)
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job -
EngineeringSchedule -
Full timeShift -
No shift premium (United States of America)Travel -
Relocation -
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"
USA Jobs 24 copied this listing from HP's official careers site on November 1, 2026 and checked it again November 4, 5:17 AM ET. HP will never ask you to pay to apply or to buy equipment with a check they send you. If anyone does, it is a scam.
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